Foreword - Special Issue on Emerging Technologies

Abstract

ITherm 2002, the 8th Intersociety Conference on Thermal, Mechanical and Thermomechanical Phenomena in Electronic Systems, hosted about 500 international experts in the areas of thermal management, thermomechanical and mechanics issues, and emerging technologies in electronic packaging and systems, from May 30 to June 1, 2002, in San Diego, CA. The Technical Program included nearly 150 peer-reviewed papers presented in 35 sessions arranged into three Tracks: Thermal Management, Applied Mechanics, and Emerging Technologies. The area of Emerging Technologies brought together engineers and scientists from industry, academia and government research organizations for exploration of emerging technology issues on electronic systems. There were 4 sessions in the Emerging Technologies area and each session had a nomination for the ITherm 02 Emerging Tech. track best paper. Of the nine papers selected for this Special Issue, four have been accepted for publication after peer review. These papers deal with wide ranging issues on emerging technologies; from thermosciences, heat transfer in Bio-MEMS, analysis and simulation of anode heating, to investigations of thermal responses of MEMS components.