3D Laser Written Mirror-Waveguide Circuits for Silicon Photonic Interconnects

Abstract

An increase in data usage following demands for faster networks over past decades has prompted data centers to scale up the density of channels and boost the network bandwidth. In this way, a new architecture for assembly and packaging of electro-optical (EO) components is now required to facilitate chip-to-chip and chip-to-network interconnections. This thesis employs femtosecond laser writing combined with 3D structural micro-machining for fabricating glass interposers and a new optical printed circuit board (OPCB) platform. The presented glass interposer provided vertical coupling from a plane of multi-core fiber (MCF) arrays to a two-dimensional (2D) grid of silicon photonics (SiP) grating couplers. The OPCB platform demonstrated a wider scope for all-glass optical routing by providing a high-density optical circuit for MCF-to-MCF linking. The interposer and OPCB optical systems provided tight-turning waveguide bends for 3D interconnectivity by developing total internal reflection (TIR) mirrors and 2D hollow-filament gratings photonic crystals (PhCs).